SOLDERING PASTE RELIFE RL-404
SOLDERING PASTE RELIFE RL-404
Description
RELIFE RL-404 solder paste is a special type of low-melting solder paste (tin in paste form) designed for soldering electronic components, i.e. SMD, BGA.
Thanks to a very low melting point of exactly 138°C, the use of paste in such a process makes it possible to carry out complicated repairs (e.g. filling the CPU in an iPhone) without exposing the remaining components of the phone to damage that may result from the need to reach a temperature of 217°C in the soldering process.
Spatulas for applying the paste can be found on our other auctions.
Technical data:
- manufacturer: RELIFE
- model: RL-404
- composition: Sn42 / Bi58 (42% tin, 58% bismuth)
- type: with lead content
- melting point: 138°C
- particle size: 20-38um
- capacity: ~35g net (40g gross)
- paste color after melting: light gray
- halogen content: <0,03%
- flux content: 9-10%
- conductivity: 14 (% fCu)
- viscosity: 178Pa.s +/-10 at 25°C
The paste should be stored at 5°C - 10°C.
