Mechanic BGA IC Strong Glue Removal S-60

Mechanic S-60 is a specialized liquid chemical formulation designed to remove hard adhesives and components from integrated circuits (BGA, IC). It is widely used in professional consumer electronics repair shops, particularly when repairing iPhones. 

Application and Properties

The solution was developed to gently yet effectively dissolve the bonds that protect delicate components on printed circuit boards.
•  Main function: Softening and removing stubborn adhesives and resins (compounds) of the BGA IC type.
• Advantages: Allows for safe removal of circuits without the risk of mechanical damage to solder pads or the printed circuit board itself.
• Capacity: Available in 20 ml bottles.