SOLDERING PASTE MECHANIC V5B45 138C
SOLDERING PASTE MECHANIC V5B45 138C
Description
Mechanic V5B45 lead-free solder paste is designed for soldering SMD, BGA components. The low-temperature paste melts already at 138°C. Product with good viscosity, no bubbles and solder balls. The product is ideal for use in soldering SMD and BGA components on motherboards of phones, laptops, SMT reabilization and other devices. The paste has a strong bonding ability with tin, good conductivity and high tin bearing capacity, which allows no rework after the application of solder balls.
Technical parameters
- manufacturer: Mechanic
- product name: V5B45
- soldering paste
- does not contain lead
- low-temperature - melting point 138°C
- package capacity: 42g
- the paste consists of thousands of nanoparticles for easy application and soldering
- good conductivity and high ease of tinning
- user friendly, easy to apply
- alloy: Sn42Bi58
- 42% tin, 58% bismuth
- for industrial use
- after opening, store the product at 5 to 10°C
- if the paste is too hard, additional flux can be added
