E8000 15ML ZHANLIDA

Instructions for use: E-8000

Read the instructions before use.

• Use only in a well-ventilated environment. The surface to be bonded should be clean, dry and free of dust. The surface should be roughened before use to ensure greater bond strength. It can be applied between 18°C and 32°C. The best temperature is between 21°C and 29°C. The adhesive can withstand a temperature range of -40°C to 66°C.
• Apply it directly to the surface to be bonded, press down firmly, it will start to thicken after about two minutes. To achieve higher strength, allow the glued parts to dry for 48 hours. When the temperature is low, the curing time will increase. When the temperature is high, the curing time is reduced.
• Storage: Store at 18-27°C

Technical data

• Solids content: 48% -55%
• Appearance: translucent, medium viscosity
• Hardness after complete hardening: 65-80A
• Surface drying time: approx. 3-6 minutes
• Overall curing time: 4-8 hours
• Full cure time: 24-48 hours
• Storage time: save from 10 to 28 degrees
• Capacity: 15ml
• Manufacturer: depending on delivery

Comments

• May irritate skin and eyes.
• Keep out of reach of children
• Use in a well-ventilated environment.
• Flush with plenty of water in case of eye contact.
• Keep away from children's shop, manufacturing operations, keep away from fire.
• Do not allow glue to overflow into the circuit board region.
• Degrease and dry both surfaces to be joined.
• Cover the surfaces with an even amount of adhesive.
• Squeeze and wait at least 3 minutes for initial setting.