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JCID Chip underfill

JCID's UF6008 5ML NAND Filling Adhesive

Manufacturer: JCID
€8.45
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Description

JCID UF6008 Nand Chip Fill Adhesive.

 


JCID UF6008 Chip Underfill is a highly reliable and efficient adhesive solution for Nand chips. With its outstanding properties including fast and uniform diffusion, automatic curing. The use of UF6008 JCID increases adhesion, improves drop resistance, reduces the risk of patching, extends the life of the device.

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